IGBT是能源(yuan)(yuan)變換與傳輸的(de)核(he)心(xin)器件，也被稱為電(dian)(dian)(dian)(dian)(dian)力(li)電(dian)(dian)(dian)(dian)(dian)子裝(zhuang)置的(de)“CPU"，主要應(ying)用(yong)在(zai)航空航天、軌道(dao)交(jiao)通、智能電(dian)(dian)(dian)(dian)(dian)網、、電(dian)(dian)(dian)(dian)(dian)動(dong)汽(qi)車(che)(che)與新(xin)能源(yuan)(yuan)裝(zhuang)備等領(ling)域。新(xin)能源(yuan)(yuan)汽(qi)車(che)(che)是通過(guo)電(dian)(dian)(dian)(dian)(dian)池(chi)驅動(dong)電(dian)(dian)(dian)(dian)(dian)機(ji)來(lai)給汽(qi)車(che)(che)提(ti)供(gong)動(dong)力(li)輸出(chu)的(de)，所以存在(zai)交(jiao)流市電(dian)(dian)(dian)(dian)(dian)給汽(qi)車(che)(che)電(dian)(dian)(dian)(dian)(dian)池(chi)充電(dian)(dian)(dian)(dian)(dian)和(he)電(dian)(dian)(dian)(dian)(dian)池(chi)放電(dian)(dian)(dian)(dian)(dian)來(lai)驅動(dong)電(dian)(dian)(dian)(dian)(dian)機(ji)使(shi)汽(qi)車(che)(che)行駛的(de)場景。這兩(liang)個(ge)過(guo)程都是需要通過(guo)使(shi)用(yong)IGBT設計的(de)電(dian)(dian)(dian)(dian)(dian)路來(lai)實(shi)現。

在(zai)新能源汽車(che)領域，常用(yong)hpd(hybrid pack drive)對(dui)igbt(insulated gate bipolar transistor)模(mo)(mo)塊進行(xing)封裝(zhuang)，igbt模(mo)(mo)塊與(yu)驅(qu)動(dong)(dong)電路板之(zhi)間一般通過塑(su)(su)料柱(zhu)dome安裝(zhuang)固定(ding)。塑(su)(su)料柱(zhu)dome易受(shou)環(huan)境溫度的(de)(de)影響(xiang)而發生熱(re)脹冷縮(suo)，導致其在(zai)膨脹或(huo)收縮(suo)時(shi)推動(dong)(dong)驅(qu)動(dong)(dong)電路板沿向上(shang)下移動(dong)(dong)，使(shi)驅(qu)動(dong)(dong)電路板發生形變，還會使(shi)igbt模(mo)(mo)塊上(shang)的(de)(de)pin針(zhen)受(shou)到向上(shang)的(de)(de)拉(la)拔力(li)或(huo)向下的(de)(de)壓力(li)，也就是說，塑(su)(su)料柱(zhu)dome的(de)(de)膨脹收縮(suo)往復運動(dong)(dong)會使(shi)pin針(zhen)頻繁(fan)受(shou)到動(dong)(dong)態的(de)(de)拉(la)力(li)，從而使(shi)pin針(zhen)和pin針(zhen)底(di)座(zuo)與(yu)銅層之(zhi)間焊接層出現疲勞斷裂的(de)(de)風險(xian)。

疲勞檢(jian)測方法和儀器

使用(yong)(yong)對上海(hai)保圣TA.TXC疲(pi)(pi)勞(lao)(lao)檢(jian)(jian)測(ce)儀對IGBT模(mo)塊(kuai)PIN針進行：“拉拔力測(ce)試(shi)(shi)"和(he)“循環疲(pi)(pi)勞(lao)(lao)"等(deng)(deng)測(ce)試(shi)(shi)，從而提升GBT功(gong)率模(mo)塊(kuai)內元件的(de)物(wu)理性能和(he)IGBT模(mo)塊(kuai)的(de)使用(yong)(yong)壽命(ming)，滿足對使用(yong)(yong)IGBT模(mo)塊(kuai)的(de)企業及要求使用(yong)(yong)壽命(ming)的(de)要求。保圣TA.TXC疲(pi)(pi)勞(lao)(lao)檢(jian)(jian)測(ce)儀廣泛用(yong)(yong)于IGBT功(gong)率模(mo)塊(kuai)的(de)疲(pi)(pi)勞(lao)(lao)檢(jian)(jian)測(ce)，還可用(yong)(yong)于其他電子芯片等(deng)(deng)疲(pi)(pi)勞(lao)(lao)檢(jian)(jian)測(ce)，應用(yong)(yong)于汽車領域、航(hang)天航(hang)空領域、軍工產品測(ce)試(shi)(shi)、研(yan)究(jiu)機構(gou)的(de)測(ce)試(shi)(shi)及各類(lei)院校的(de)測(ce)試(shi)(shi)研(yan)究(jiu)等(deng)(deng)應用(yong)(yong)。